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Last Post 07 Oct 2014 01:20 PM by  Adam Ford
Keepout area under SOM (dev board does not match docs)
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Ryan Crowell
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06 Oct 2014 08:35 AM

    In Rev F of the DM3730/AM3703 Torpedo + Wireless SOM Hardware Specification, note 2 on the mechanical drawings says "DO NOT PLACE ANY COMPONENTS OR EXPOSED VIAS WITHIN LAYOUT AREA OF SOM".  On the dev board that we bought, however, there is no soldermask beneath the SOM and there are many exposed signal and power vias which are confined to the area immediately adjacent to the 100-pin connectors. 

    Can someone please clarify the note 2 requirements?

    Thank you.
    Adam Ford
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    06 Oct 2014 09:01 AM
    The concept is to avoid any unintended connections between signals. If it were to become necessary to change a component on the SOM in the future, having parts or components under the SOM may cause a clearance issue with the SOM itself. It is important to avoid putting anything under it.

    On our board, the large open copper area is tied to ground. Doing this can help reduce unwanted interference between any fast-switching signals on the board and the the SOM.

    -adam

    Ryan Crowell
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    07 Oct 2014 09:29 AM
    Thanks Adam. Is there any reason that the copper area under the SOM must be stripped of soldermask? I understand that the finger gasket grounds must contact bare copper, but what about the rest of the area?
    Thanks,
    Ryan
    Adam Ford
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    07 Oct 2014 01:20 PM
    You should be OK with having soldermask cover the rest of the area. Just make sure you leave exposed copper for the fingers to get a good connection to ground.

    adam
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